Neuer Termin: 25. – 26. Februar 2026 I Messe Dortmund

2. – 3. Juni 2026 I Hamburg Messe

REA press release
REA Elektronik GmbH

REA press release

Reliable marking and code verification for a changing packaging world

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REA will present new solutions at Empack 2025

With REA, the packaging industry has a global specialist at its side for its diverse requirements for marking and code verification. Its intelligent solutions support them in using resources more sustainably, taking market requirements into account and complying with regulations. REA will be presenting what these are – including some innovations – from January 22th to 23th at Empack 2025 in Zurich.

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